A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...

Faraday Technology Corporation (TWSE: 3035) today announced the launch of its 2.5D/3D advanced package service.

The transition from 3D to 5D ascension is a transformative journey that invites you to transcend the limitations of the physical world and embrace a higher state of consciousness.

Packaging teams have been dealing with some of the same issues in 2.5D stacking that were in MCMs, but 3D stacked die present some entirely new problems.

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated ...

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level.

2.5D has marked advantages of capacity, performance, system space and overall system power consumption over traditional single die implementations—3D promises to have even more.

Experimental data has been obtained on nanostructured glass that could help to preserve huge amounts of data for over one million years, which may help record historical data for future generations.